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Tek-Sil® SA Materials
Tek-Sil® SA Materials
TEK-SIL SA is an unsupported thermally conductive silicone rubber with high dielectric strength to protect against power surges. Available in four thicknesses, TEK-SIL SA conforms well to irregular surfaces while protecting assemblies from mechanical shock and absorbing thermal expansion. TEK-SIL SA offers thermal conductivity along with electrical isolation for heat transfer applications between PC Boards and Heat Sinks and can be used to fill air gaps between PC Boards and Heat Sinks. Maximum roll width is 18".
| Tek-Sil SA Thicknesses | |
|---|---|
| Measurement: | |
| .025"+/-.003" | ( .64mm+/- .8) |
| .032"+/-.005" | ( .82mm+/-.13) |
| .050"+/-.005" | (1.27mm+/-.13) |
| .062"+/-.005" | (1.57mm+/-.13) |
| Tek-Sil SA Properties | ||
|---|---|---|
| Properties | Unit | SA-025, SA-032, SA-062 |
| Elongation | % | 200 |
| Hardness | shore A | 65 |
| Dielectric Volts | mil | 450 |
| Thermal Conductivity Watts | m-k | 1.3 |
| Thermal Impedance | ºC in2/W (1/16Ó) | 1.25 |
| Break Strength | psl | 250 |
| Dielectric Strength | volts/mil | 250 |
| Volume Resistivity | ohm-cm | 5.00E+15 |
| UL | 94 | HB |
| Color | visual | blue |
| Temperature | F | -80 to +400 |
| Temperature | C | -62 to +204 |
Features/Benefits
- Filled silicone rubber material which does not require curing
- Formulated to provide clean release from most surfaces
- Material is rigid enough to be easily die cut
- Gap filler can be readily repositioned